White Paper

Preparing for the Multiphysics Future of 3D ICs

Preparing for the Multiphysics Future of 3D ICs

3D ICs are transforming semiconductor design, but they bring complex multiphysics challengesā€”thermal effects, mechanical stress, and electrical integrity issues. Traditional 2D methodologies fall short. A shift-left approach to multiphysics verification is essential to detect issues early, ensuring high-yield, reliable designs.

Discover how Calibreā€™s advanced verification solutions help:

  • Optimize performance
  • Reduce costly rework
  • Accelerate time-to-market

Download the white paper to explore proven strategies for mastering 3D IC multiphysics analysis.

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